|
Shenzhen XingdaYun Technology Co., Ltd.
|
BGA encapsulate pcb assembly 4 layer pcb multilayer circuit board SGS , RoHS
| Place of Origin: | Zhejiang, China (Mainland) |
|
|
| Add to My Favorites | |
| HiSupplier Escrow |
Product Detail
BGA encapsu
BGA encapsulate pcb assembly 4 layer pcb multilayer circuit board SGS , RoHS
Specifications
1.PCB&PCBA assembly services
2.Approval: ISO9001:2008 ,SGS,RoHS
3.Fast Lead Time and Delivery
Your Best Choice for Printed Circuit Board Manufacturing & Assembly
OEM/ODM/EMS Services for PCBA:
- PCBA, PCB Board assembly: SMT & PTH & BGA
- PCBA and enclosure design
- Components sourcing and purchasing
- Quick prototyping
- Plastic injection molding
- Metal sheet stamping
- Final assembly
- Test: AOI, In-Circuit Test (ICT), Functional Test (FCT)
- Custom clearance for material importing and product exporting
Capability - SMT
- Lines 9(5 Yamaha,4KME)
- Capacity 52 million placements per month
- Max Board Size 457*356mm.(18”X14”)
- Min Component size 0201-54 sq.mm.(0.084 sq.inch),long connector,CSP,BGA,QFP
- Speed 0.15 sec/chip,0.7 sec/QFP
Capability - PTH
- Lines 2
- Max board width 400 mm
- Type Dual wave
- Pbs status Lead-free line support
- Max temp 399 degree C
- Spray flux add-on
- Pre-heat 3
Technical Data:
|
Stencil size/range: |
736x736mm |
|
Minimum IC pitch: |
0.30mm |
|
Maximum PCB size: |
1200x 500mm |
|
Minimum PCB thickness: |
0.35mm |
|
Minimum chip size: |
0201 (0.2x0.1)/0603 (0.6 x 0.3mm) |
|
Maximum BGA size: |
74x74mm |
|
BGA ball pitch: |
1.00mm (minimum), 3.00mm (maximum) |
|
BGA ball diameter: |
0.40mm (minimum), 1.00mm (maximum) |
|
QFP lead pitch: |
0.38mm (minimum), 2.54mm (maximum) |
|
Frequency of stencil cleaning: |
1 time/5 to 10 pieces |
|
Turn Times: |
Quick turn are our Specialty |
|
Shenzhen XingdaYun Technology Co., Ltd. [China (Mainland)]
Business Type:Manufacturer, Distributor/Wholesaler |
