Shenzhen XingdaYun Technology Co., Ltd.
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Place of Origin: | Zhejiang, China (Mainland) |
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PCB Capability
Layer | 2-12 layers |
Board thickness | 0.2-6.0 mm |
Laminates type | FR-4, CEM-1, CEM-3, BT Resin, Teflon, PTFE, Rogers, Aluminium, Tg130(150,170,180, 210), Berquist, Thermagon, Alon.Polyclad |
Base copper thickness |
Min: 12um (1/3oz) Max: 140um (4oz) for inner layer; 210um (6oz) for outer layer |
Min finished hole size | By mechanical drilling: 0.2mm (0.008") |
Aspect ratio | 8:1 |
Max panel size |
Mass production: 540mm × 740m (21.25" × 29.13") Sample: 540mm × 1100mm (21.25" × 43.3") |
Min line width/space | 3 mil/3 mil |
Via hole type | Blind, Burried |
Surface finish |
HASL/ Lead Free HASL, Immersion Gold / Silver / Tin, Flash Gold, Hard Gold plating, Selective thick Gold Plating, Gold Finger (Gold thickness up to 3um), Plating Silver, Carbon ink, Peelable mark, OSP |
Solder mask |
All kinds of colour, LPI, Dry Film, Min S/M pitch (LPI): 0.1mm |
Impedance Control |
Single trace or differential controlled 50, 60, 70, 100, 110, 120, 130 ±10% |
Min bonding pitch | 0.181mm (center to center) |
Min SMT pitch | 0.400mm (center to center) |
Min annular ring | 0.025mm |
Outline finish type | CNC Routing; V-Scoring/Cut; Punch |
Tolerances |
Min Hole registration tolerance (NPTH) ± 0.025mm Min Hole registration tolerance (PTH) ± 0.075mm Min Pattern registration tolerance ± 0.05mm Min S/M registration tolerance (LPI) ± 0.075mm Scoring Lines ± 0.15mm Board thickness (0.1 -1.0mm ) ±15%
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