Gold Index: 9354
Item
Capabilities
1.Base Material
FR-4 / High TG FR-4 / Lead free Materials (ROHS Compliant) /
Halogen Free material /CEM-3/CEM-1/ /PTFE/ROGERS/ARLON/TACONIC
2.Layers
1-30
3.Finised inner/outer copper thickness
1-12OZ
4.Finished board thickness
0.2-7.0mm
Tolerance
Board thickness≤1.0mm: +/-0.1mm
1<Board thickness≤2.0mm: +/-10%
Board thickness>2.0mm: +/-8%
5.Max panel size
≤2sidesPCB: 600*1500mm
Multilayer PCB: 500*1200mm
6.Min conductor line width/spacing
Inner layers: ≥3/3mil
Outer layers: ≥3.5/3.5mil
7.Min hole size
Mechanical hole: 0.15mm
Laser hole: 0.1mm
Drilling precision: first drilling
First drilling: 1mil
Second drilling: 4mil
8.Warpage
Board thickness≤0.79mm: β≤1.0%
0.80≤Board thickness≤2.4mm: β≤0.7%
Board thickness≥2.5mm: β≤0.5%
9.Controlled Impedance
+/-5%
Shenzhen XingdaYun Technology Co., Ltd. [China (Mainland)]
Business Type:Manufacturer, Distributor/Wholesaler City: Shenzhen Province/State: Guangdong Country/Region: China (Mainland)