|
Shenzhen XingdaYun Technology Co., Ltd.
|
FR1 / CEM1 Gold finger 6 layer PCB multilayer printed circuit board 1 - 3oz
| Place of Origin: | Zhejiang, China (Mainland) |
|
|
| Add to My Favorites | |
| HiSupplier Escrow |
Product Detail
FR1 / CEM1
FR1 / CEM1 Gold finger 6 layer PCB multilayer printed circuit board 1 - 3oz
Specifications
2.UL,ROHS,ISO,SGS,Layer:1-20PCB
3.12 years experience in PCB
4.Drill Size:0.1mm,Line:3mil PCB
pcb /Immersion gold circuit pcb, pcba & fpc , multilayer pcb/gold finger 6 layer PCB
|
Item |
Manufacture Capability |
|
Mterial |
FR-4 / Hi Tg FR-4 / Lead free Materials (RoHS Compliant) /CEM-3, Aluminum, Metal based,FR1/CEM1 |
|
Layer No. |
1-- 20 |
|
Finished Board thickness |
0.2 mm-4.0mm’(8 mil-160 mil) |
|
Board Thickness Tolerance |
±10% |
|
Cooper thickness |
0.5 OZ-6OZ (18 um-210 um) |
|
Copper Plating Hole |
18-40 um |
|
Impedance Control |
±10% |
|
Warp &Twist |
0.50% |
|
Peelable |
0.012"(0.3mm)-0.02’(0.5mm) |
|
Images |
|
|
Min Trace Width |
0.075mm (3mil) |
|
Min Space Width |
0.075mm (3mil) |
|
Min Annular Ring |
0.1mm (4 mil) |
|
Solder Mask |
|
|
Min Solder Mask Dam |
0.0635 mm (2.5mil) |
|
Solder mask Clearance |
0.1mm (4 mil) |
|
Holes |
|
|
Min Hole size (CNC) |
0.1 mm (4 mil) |
|
Min Punch Hole Size |
0.9 mm (35 mil) |
|
Hole Size Tol (+/-) |
PTH:±0.075mm;NPTH: ±0.05mm |
|
Hole Position Tol |
±0.075mm |
|
Plating |
|
|
HASL |
2.5um |
|
Lead free HASL |
2.5um |
|
Immersion Gold |
Nickel 3-7um Au:1-5u'' |
|
OSP |
0.2-0.5um |
|
Certificate |
Shenzhen XingdaYun Technology Co., Ltd. [China (Mainland)]
Business Type:Manufacturer, Distributor/Wholesaler |
