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Shenzhen XingdaYun Technology Co., Ltd.
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Multilayer Hi Tg FR-4 , FR1 BGA HDI 6 layer PCB Board ENIG Surface
| Place of Origin: | Zhejiang, China (Mainland) |
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Product Detail
Multilayer
Multilayer Hi Tg FR-4 , FR1 BGA HDI 6 layer PCB Board ENIG Surface
Specifications
2.UL,ROHS,ISO,SGS,Layer:1-20PCB
3.many years experience in PCB
4.Drill Size:0.1mm,Line:3mil PCB
pcb /Immersion gold circuit pcb, pcba & fpc , multilayer pcb/BGA HDI 6 layer PCB
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Item |
Manufacture Capability |
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Mterial |
FR-4 / Hi Tg FR-4 / Lead free Materials (RoHS Compliant) /CEM-3, Aluminum, Metal based/FR1/CEM1/FPC |
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Layer No. |
1-- 20 |
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Finished Board thickness |
0.2 mm-4.0mm’(8 mil-160 mil) |
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Board Thickness Tolerance |
±10% |
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Cooper thickness |
0.5 OZ-6OZ (18 um-210 um) |
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Copper Plating Hole |
18-40 um |
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Impedance Control |
±10% |
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Warp &Twist |
0.50% |
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Peelable |
0.012"(0.3mm)-0.02’(0.5mm) |
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Images |
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Min Trace Width |
0.075mm (3mil) |
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Min Space Width |
0.075mm (3mil) |
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Min Annular Ring |
0.1mm (4 mil) |
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Solder Mask |
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Min Solder Mask Dam |
0.0635 mm (2.5mil) |
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Solder mask Clearance |
0.1mm (4 mil) |
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Holes |
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Min Hole size (CNC) |
0.1 mm (4 mil) |
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Min Punch Hole Size |
0.9 mm (35 mil) |
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Hole Size Tol (+/-) |
PTH:±0.075mm;NPTH: ±0.05mm |
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Hole Position Tol |
±0.075mm |
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Plating |
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HASL |
2.5um |
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Lead free HASL |
2.5um |
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Immersion Gold |
Nickel 3-7um Au:1-5u'' |
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OSP |
0.2-0.5um |
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Certificate |
Shenzhen XingdaYun Technology Co., Ltd. [China (Mainland)]
Business Type:Manufacturer, Distributor/Wholesaler |
