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OSP HAL Immersion Tin 6 layer motherboard pcb 0.02mm through hole copper 

Place of Origin: Zhejiang, China (Mainland) 
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OSP HAL Immersion Tin 6 layer motherboard pcb 0.02mm thr

OSP HAL Immersion Tin 6 layer motherboard pcb 0.02mm through hole copper

 

Specifications

a. PCB&PCBA
b. PCB COPY
c. UL,ISO,TS
d. PCB FACTORY
e. ACCEPT THE SMALL ORDER

 

TECHNICAL DATAS

 

No.  items Spec
1 Layers 1 to 24 layers
2 Max working panel area 457 x 610 mm
3 Min board thickness 4 layer: 0.40mm
6 layer: 0.80mm
8 layer: 1.00mm
10 layer: 1.20mm
4 Min trace width 0.10mm
5 Min spacing 0.10mm
6 Min hole diameter 0.20mm
7 Min Copper thickness in hole 0.020mm
8 PTH size tolerance ±0.05mm
9 NPTH size tolerance ±0.025mm
10 Hole position tolerance ±0.05mm
11 Dimension tolerance ±0.1mm
12 Min solder mask dam 0.08mm
13 Insulation resistance 1E+12Ω (normal condition)
14 Max Board thickness/Hole size Rate '10:01:00 AM
15 Thermal shock endurance 288 3 times in 10sec
16 Max Board twist and wrap ≤0.7%
17 High Vlotage endurance 1.3KV/mm
18 Copper foil peel off endurance 1.4N/mm
19 Hardness of resist ink ≥6H
20 Flame resistance 94V-0
21
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Company Info

Shenzhen XingdaYun Technology Co., Ltd. [China (Mainland)]


Business Type:Manufacturer, Distributor/Wholesaler
City: Shenzhen
Province/State: Guangdong
Country/Region: China (Mainland)

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