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Shenzhen XingdaYun Technology Co., Ltd.
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Double Sided FR4 Printed Circuit Board of Immersion Gold Finish PCB 1 - 30 Layer
| Place of Origin: | Zhejiang, China (Mainland) |
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Product Detail
Double Side
Double Sided FR4 Printed Circuit Board of Immersion Gold Finish PCB 1 - 30 Layer
Specifications
1.High quality,Best service
2.Quick turn
3 Own factory
Double Sided FR4 Printed Circuit Board of Immersion Gold Finish PCB
Detail:
(1)PCB and PCBA
(2)PCB Copy
(3)UL,ISO,RoHS,SGS,IPC
(4)PCB manufacturer
(5)Small order accepted
(6)high quality and resonable price
- specialized in single-sided PCB, double-sided PCB, multilayer PCB and PCBA.
- Material Type: FR4,CEM-1,non-halogen,Aluminium, high frequency, 94-V0, PI, High TG
- Surface treatment: HASL, LF, Immersion Gold, Immersion Tin/ silver, Gold Finger, OSP
Specification:
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Item |
Capabilities |
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1.Base Material |
FR-4 / High TG FR-4 / Lead free Materials (ROHS Compliant) / Halogen Free material /CEM-3/CEM-1/ /PTFE/ROGERS/ARLON/TACONIC |
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2.Layers |
1-30 |
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3.Finised inner/outer copper thickness |
1-12OZ |
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4.Finished board thickness |
0.2-7.0mm |
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Tolerance |
Board thickness≤1.0mm: +/-0.1mm 1<Board thickness≤2.0mm: +/-10% Board thickness>2.0mm: +/-8% |
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5.Max panel size |
≤2sidesPCB: 600*1500mm Multilayer PCB: 500*1200mm |
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6.Min conductor line width/spacing |
Inner layers: ≥3/3mil Outer layers: ≥3.5/3.5mil |
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7.Min hole size |
Mechanical hole: 0.15mm Laser hole: 0.1mm |
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Drilling precision: first drilling |
First drilling: 1mil Second drilling: 4mil |
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8.Warpage |
Board thickness≤0.79mm: β≤1.0% 0.80≤Board thickness≤2.4mm: β≤0.7% Board thickness≥2.5mm: β≤0.5% |
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9.Controlled Impedance |
+/-5% |
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10. Aspect Ratio |
15:1 |
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11.Min welding ring |
4mil |
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