Item
|
Capabilities
|
1.Base Material
|
FR-4 / High TG FR-4 / Lead free Materials (ROHS Compliant) /
Halogen Free material /CEM-3/CEM-1/ /PTFE/ROGERS/ARLON/TACONIC
|
2.Layers
|
1-30
|
3.Finised inner/outer copper thickness
|
1-12OZ
|
4.Finished board thickness
|
0.2-7.0mm
|
Tolerance
|
Board thickness≤1.0mm: +/-0.1mm
1<Board thickness≤2.0mm: +/-10%
Board thickness>2.0mm: +/-8%
|
5.Max panel size
|
≤2sidesPCB: 600*1500mm
Multilayer PCB: 500*1200mm
|
6.Min conductor line width/spacing
|
Inner layers: ≥3/3mil
Outer layers: ≥3.5/3.5mil
|
7.Min hole size
|
Mechanical hole: 0.2mm
Laser hole: 0.1mm
|
Drilling precision: first drilling
|
First drilling: 1mil
Second drilling: 4mil
|
8.Warpage
|
Board thickness≤0.79mm: β≤1.0%
0.80≤Board thickness≤2.4mm: β≤0.7%
Board thickness≥2.5mm: β≤0.5%
|
9.Controlled Impedance
|
+/-5%
|
10. Aspect Ratio
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