Shenzhen XingdaYun Technology Co., Ltd.
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Place of Origin: | Zhejiang, China (Mainland) |
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fr4 1.6mm lighting electronic circuit board
Process Capability | ||
ltem | Mass Production | Prototype |
Surface Treatment | HASL(LF) | HASL(LF) |
Immersion Gold | Immersion Gold | |
Flash Gold | Flash Gold | |
OSP | OSP | |
Immersion Tin | Immersion Tin | |
Immersion Silver | Immersion Silver | |
HASL&Gold Finger | HASL&Gold Finger | |
selective nickel | selective nickel | |
HASL(LF) | smt Pad:>3um | smt Pad:>4um |
Big Cu:>lum | Big Cu:>l.5um | |
Immersion Tin | 0.4-0.8um | 0.8-1.2um |
Immersion Gold | Ni:2-5urn | Ni:3-6urn |
Au:0.05-0.10um | Au:0.075-0.15um | |
Immersion Silver | 0.2-0.6um | 0.3-0.6um |
OSP | 0.1-0.4um | 0.25-0.4um |
Flash Gold | Ni:3-6urn | Ni:3-6urn |
Au:0.01-0.05um | Au:0.02-0.075um | |
Laminates | CEM-3,PTFE | CEM-3,PTFE |
FR4 (HighTG etc) | FR4(HighTG etc) | |
Metal Base(AL,CUetc) | Metal Base(AL,CUetc) | |
Rogors,etc | Rogors,etc | |
MAX.Layers | 12(Layers) | 40(Layers) |
MAX.Board Size | 20"X48" | 20"X48" |
Board Thickness
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